Duct for cooling multiple components in a processor-based device

ABSTRACT

A duct for cooling multiple components in a processor-based device. The duct has an inlet cooling duct section for a cooling airflow focused toward a processor region. The duct also has at least one exit cooling duct section for the cooling airflow extending from the inlet cooling duct section and focused toward a component region, wherein the cooling airflow is successively transportable through the processor region followed by the component region. A processor-based system having a focused cooling duct. The focused cooling duct comprises an inlet cooling duct section for a cooling airflow having a fan receptacle, and a plurality of exit cooling duct sections for the cooling airflow extending from the inlet cooling duct section and focused toward component regions, wherein the cooling airflow is successively transportable through the inlet cooling duct section followed by the plurality of exit cooling duct sections. The processor-based system also comprises a plurality of components disposed in the component regions.

BACKGROUND OF THE INVENTION

[0001] Computer systems and other processor-based devices utilize avariety of cooling systems, such as fans and heat sinks, to maintain thecomponents at acceptable operating temperatures. Depending on theparticular application, one or more fans may be provided to flow airacross the components. For example, a computer system may have one ormore casing fans, processor fans, and other component-specific fans.Unfortunately, the relatively cool inlet airflows may be mixed with theair heated by internal components, thereby increasing the temperature ofthe inlet airflows. As the inlet airflows are heated by the internalcomponents, the inlet airflows become relatively less effective attransferring heat away from specific components due to the reducedtemperature differential between the inlet airflows and the specificcomponents.

SUMMARY

[0002] According to one embodiment of the invention, a duct for coolingmultiple components in a processor-based device comprises an inletcooling duct section for a cooling airflow focused toward a processorregion. The duct also comprises at least one exit cooling duct sectionfor the cooling airflow extending from the inlet cooling duct sectionand focused toward a component region, wherein the cooling airflow issuccessively transportable through the processor region followed by thecomponent region.

[0003] In another embodiment, a processor-based system comprises afocused cooling duct. The focused cooling duct comprises an inletcooling duct section for a cooling airflow having a fan receptacle, andat least one exit cooling duct section for the cooling airflow extendingfrom the inlet cooling duct section and focused toward a componentregion, wherein the cooling airflow is successively transportablethrough the inlet cooling duct section followed by the plurality of exitcooling duct sections.

[0004] In a further embodiment, a cooling system comprises means forchanneling a cooling airflow across at least one processor. The coolingsystem also comprises means for subsequently refocusing via a duct thecooling airflow across at least one electronic component downstream fromthe at least one processor.

[0005] Another embodiment comprises a method for cooling multiplecomponents in a processor-based device. The method comprises channelinga forced cooling airflow across a processor to transfer heat away fromthe processor. The method also comprises refocusing via a duct theforced cooling airflow heated by the processor toward at least one otherelectronic component downstream from the processor to transfer heat awayfrom the at least one other electronic component.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Exemplary embodiments will hereafter be described with referenceto the accompanying drawings, wherein like reference numerals denotelike elements, and:

[0007]FIG. 1 is a top perspective view illustrating amulti-component-focused-cooling duct in accordance with certainembodiments of the present invention;

[0008]FIG. 2 is a bottom perspective view illustrating an embodiment ofthe multi-component-focused-cooling duct of FIG. 1;

[0009]FIG. 3 is a side view illustrating an embodiment of aprocessor-based device having the multi-component-focused-cooling ductof FIG. 1 disposed about a fan-cooled processor;

[0010]FIG. 4 is a perspective view illustrating an embodiment of theprocessor-based-device of FIG. 3;

[0011]FIG. 5 is a perspective view illustrating an alternativemulti-component-focused-cooling duct in accordance with certainembodiments of the present invention;

[0012]FIG. 6 is an exploded perspective view illustrating inlet andoutlet duct sections of the multi-component-focused-cooling duct of FIG.5 in accordance with certain embodiments of the present invention; and

[0013]FIG. 7 is a bottom perspective view illustrating an embodiment ofthe inlet duct section of FIG. 6.

DETAILED DESCRIPTION

[0014]FIG. 1 is a top perspective view illustrating amulti-component-focused-cooling duct 10 in accordance with certainembodiments of the present invention. As illustrated, themulti-component-focused-cooling duct 10 comprises an air inlet and fanreceptacle 12 disposed in a top panel 14 adjacent an inlet air deflector16, which operates to deflect an inlet airflow 18 over the top panel 14and at least partially into the air inlet and fan receptacle 12. Forexample, if a duct fan (not shown) is disposed in the fan receptacle 14,then the duct fan may draw a portion of the inlet airflow 18 into themulti-component-focused-cooling duct 10 below the top panel 14. Oncebelow the top panel 14, the inlet airflow 18 may cool one or morecomponents within the multi-component-focused-cooling duct 10 in afocused-component-cooling region (i.e., a cooling region in which theflow is directed and/or accelerated specifically toward a desiredcomponent to facilitate cooling). For example, the inlet airflow 18 maycool one or more temperature sensitive components (e.g., processors)disposed within the multi-component-focused-cooling duct 10, therebytransferring heat away from the components and into the inlet airflow18.

[0015] The illustrated multi-component-focused-cooling duct 10 alsocomprises air exit ducts 20 and 22, which refocus (e.g., redirect,concentrate, and/or accelerate) the component-heated air toward one ormore components in additional focused-component-cooling regions, asindicated by exit airflows 24 and 26, respectively. Although the exitairflows 24 and 26 have a relatively higher temperature than the inletairflow 18, the air exit ducts 20 and 22 may channel the exit airflows24 and 26 to one or more relatively higher-temperature components. Forexample, the higher-temperature components may have a higher operatingtemperature or a higher temperature tolerance than the upstreamcomponents or processors. In operation, heat is transferred away fromthe higher-temperature components and into the exit airflows 24 and 26.The air exit ducts 20 and 22 also may restrict one or both of the exitairflows 24 and 26 to concentrate the airflow and increase the airvelocity and cooling efficiency of the exit airflows 24 and 26. Forexample, the air exit ducts 20 and 22 may have a converging passagewayaimed toward the desired components. As the exit airflows 24 and 26 passthrough this converging passageway, the airflow velocities rise andincrease the effectiveness of the airflows at transferring heat awayfrom the desired components. Successive channels andcomponent-focused-ducts also may be provided to cool successivelyhigher-temperature components. Accordingly, themulti-component-focused-cooling duct 10 may cool a plurality ofcomponents one after the other by refocusing the airflow toward adownstream component after each successive upstream component.

[0016] The multi-component-focused-cooling duct 10 also may comprise avariety of mounting and positional support structures. As illustrated,the multi-component-focused-cooling duct 10 comprises tool-free mountsor vertical retention members or fins 28 and 30. In assembly, themulti-component-focused-cooling duct 10 is positioned between upper andlower structures or components, such that the mounts or fins 28 and 30abut against the upper structure above the top panel 14 of themulti-component-focused-cooling duct 10. Accordingly, the interaction ofthe mounts or fins 28 and 30 against the upper structure creates adownward force, which operates to vertically retain themulti-component-focused-cooling duct 10 on the lower structure. Themulti-component-focused-cooling duct 10 also may have one or more mountsor supports at a bottom-side of the top panel 14, as illustrated in FIG.2.

[0017]FIG. 2 is a bottom perspective view illustrating an embodiment ofthe multi-component-focused-cooling duct 10 of FIG. 1. As illustrated,the multi-component-focused-cooling duct 10 comprises mounts orretention members 32, 34, 36, and 38, which may be coupled with matingmembers on a lower structure or components (not shown). For example, theretention members 32, 34, 36, and 38 may comprise female members orreceptacles that are engageable with male members disposed on the lowerstructure. However, the retention members 32, 34, 36, and 38 maycomprise any suitable tool-free or tool-based retention mechanism, suchas a snap-fit mechanism, a latch, a threaded fastener, and so forth. Inoperation, the multi-component-focused-cooling duct 10 may be loweredonto the lower structure such that the retention members 32, 34, 36, and38 engage the mating members. An upper structure or component may thenbe disposed over the multi-component-focused-cooling duct 10 in contactwith the mounts or fins 28 and 30, thereby creating a downward retentionforce. Accordingly, the retention members 32, 34, 36, and 38 laterallyretain the duct 10, while the mounts or fins 28 and 30 vertically retainthe duct 10. Again, any suitable tool-free or tool-based mounts orretention mechanisms may be employed.

[0018]FIG. 3 is a side view illustrating an embodiment of aprocessor-based device 40 having the multi-component-focused-coolingduct 10 of FIG. 1 disposed about a fan-cooled processor assembly 42. Asillustrated, an upper component 44 abuts against the mounts or fins 28and 30 of the multi-component-focused-cooling duct 10, therebyvertically retaining the duct 10 against a lower circuit board 46 andcorresponding base structure or casing 48. For example, the uppercomponent 44 may comprise a hard disk drive, an optical drive (e.g., acompact disk drive, a digital video disk drive, etc.), or any othersuitable structure or component. The retention members 32, 34, 36, and38 also engage processor-mounting fasteners 50, which secure thefan-cooled processor assembly 42 to the lower circuit board 46. Asillustrated, the multi-component-focused-cooling duct 10 is positionedabout a plurality of components, such as the fan-cooled processorassembly 42 and a heat sink and/or component 52. Adjacent themulti-component-focused-cooling duct 10, the processor-based device 40also has one or more fan units, such as fan 54.

[0019] In operation, the fan 54 draws fresh/cool air into theprocessor-based device 40, thereby directing the inlet airflow 18 intothe multi-component-focused-cooling duct 10. As discussed above, the airinlet deflector 16 channels the inlet airflow 18 up over the top panel14 of the multi-component-focused-cooling duct 10. At the air inlet andfan receptacle, a fan 56 of the fan-cooled processor assembly 42 draws aportion of the inlet airflow 18 into the multi-component-focused-coolingduct 10 and over a processor 58 of the fan-cooled processor assembly 42,thereby transferring heat away from the processor 58 and into the inletairflow. The multi-component-focused-cooling duct 10 then refocuses(e.g., redirects, concentrates, and/or accelerates) the processor-heatedair outwardly through the air exit ducts 20 and 22 onto additionalcomponents, such as higher-temperature components. As discussed above,the higher-temperature components may have a higher operatingtemperature or a higher temperature tolerance than the upstreamcomponents or processors. Accordingly, after the airflow cools (and isheated by) the processor 58, a sufficient heat differential remainsbetween the airflow and the higher-temperature components to cool therelatively higher-temperature components. In the illustrated embodiment,the duct 10 focuses (e.g., directs and/or accelerates) a portion of theprocessor-heated air outwardly through the air exit duct 22 and onto thecomponent 52, as indicated by the exit airflow 26. Another portion ofthe processor-heated air may be channeled outwardly through the air exitduct 20 and onto a component 60, as indicated by the exit airflow 24 inFIG. 4.

[0020]FIG. 4 is a perspective view illustrating an embodiment of theprocessor-based-device 40 of FIG. 3. As discussed above, themulti-component-focused-cooling duct 10 intakes an air inflow 18 fromthe fan 54, focuses (e.g., directs, channels, concentrates, and/oraccelerates) the air inflow 18 through the fan receptacle 12 and ontothe processor 58 via the fan 56, and then refocuses (e.g., redirects,concentrates, and/or accelerates) the processor-heated air onto one ormore components at the air exit ducts 20. Accordingly, themulti-component-focused-cooling duct 10 may transmit an airflow to coola plurality of successive components one after the other by refocusingthe airflow toward a downstream cooling region after each upstreamcooling region. Each of these cooling regions may be described as afocused-component-cooling region, because the duct 10 focuses theairflow toward a cooling region for a particular component. It alsoshould be noted that the duct 10 may focus the airflow toward thesefocused-component-cooling regions by aiming or targeting, concentrating,and accelerating the airflow toward the cooling region for theparticular component. Accordingly, a relatively greater amount of heatcan be transferred away from the particular components disposed in eachof the focused-component-cooling regions.

[0021]FIG. 5 is a perspective view illustrating an alternativemulti-component-focused-cooling duct 100 in accordance with certainembodiments of the present invention. As illustrated, themulti-component-focused-cooling duct 100 comprises an air inlet duct 102extending to a plurality of air exit ducts, such as air exit ducts 104,106, and 108. In operation, the multi-component-focused-cooling duct 100intakes an inlet airflow 110 through the air inlet duct 102 via one ormore internal and external fans (not shown). Using the inlet airflow110, one or more components may be cooled within themulti-component-focused-cooling duct 100. For example, themulti-component-focused-cooling duct 100 may focus the inlet airflow 110onto one or more processors or other temperature-sensitive componentsdisposed within the duct 100. In thisprocessor-focused-component-cooling region, heat transfers away from theone or more processors and into the inlet airflow 110.

[0022] The multi-component-focused-cooling duct 100 then refocuses(e.g., redirects and/or accelerates) the processor-heated air outwardlythrough the air exit ducts 104, 106, and 108 into additionalfocused-component-cooling regions, as indicated by exit airflows 112,114, and 116, respectively. For example, the duct 100 may focus the exitairflows 112, 114, and 116 onto one or more relatively highertemperature components (e.g., components having higher temperaturetolerances), which can be effectively cooled by the processor-heatedair. Moreover, the duct 100 may accelerate the exit airflows 112, 114,and 116 to improve the heat transfer away from the components and intothe respective exit airflows 112, 114, and 116.

[0023] The illustrated multi-component-focused-cooling duct 100 also maycomprise a variety of tool-free or tool-based mounts and supportstructures, such as a snap-fit mechanism, a latch, a threaded fastener,a rail mechanism, and so forth. For example, themulti-component-focused-cooling duct 100 may snap on or latch to acircuit board or component, such as a processor. Additionally, themulti-component-focused-cooling duct 100 may have a variety of cablesupports, such as cable hooks 118, 120, and 122.

[0024]FIG. 6 is an exploded perspective view illustrating inlet andoutlet duct sections 124 and 126 of the multi-component-focused-coolingduct 100 of FIG. 5 in accordance with certain embodiments of the presentinvention. As illustrated, the outlet duct section 126 comprises fanreceptacles 128 and 130 to house fans or fan-cooled-components, such asfan units 132 and 134. A plug also may be disposed in one of the fanreceptacles 128 and 130 for a single fan or single processorconfiguration. For a dual fan-cooled processor configuration, the plugmay be removed and replaced with one of the fan units 132 and 134. Forexample, the multi-component-focused-cooling duct 100 may cool a pair ofprocessors disposed below the fan units 132 and 134 in afocused-processor-cooling region. In operation, heat is transferred fromthe one or more processors to the inlet airflow 110 passing through thefocused-processor-cooling region. If one of the fan units 132 and 134ceases to operate, then the remaining fan unit can continue to force airacross the one or more processors and ensure adequate cooling. Asdiscussed above, the multi-component-focused-cooling duct 100 thenrefocuses the airflow toward additional focused-component-coolingregions via the air exit ducts 104, 106, and 108.

[0025] For additional protection and air focusing, the inlet ductsection 124 may be disposed over the outlet duct section 126, such thatthe inlet duct section 124 covers the fan receptacles 128 and 130 andcorresponding fan-cooled-components or fan units 132 and 134. Anysuitable tool-free or tool-based couplings may be used to couple theinlet and outlet duct sections 124 and 126. However, the illustratedmulti-component-focused-cooling duct 100 has a plurality of snap-fitmechanisms or latches disposed on the inlet and outlet duct sections 124and 126. As illustrated in FIG. 6, the outlet duct section 126 comprisesmale latches or snap fit members 136, 138, 140, and 142, which arecoupleable with mating latches or snap fit receptacles on the inlet ductsection 124. As illustrated in the bottom perspective view of FIG. 7,the inlet duct section 124 comprises female snap-fit members or latchreceptacles 144, 146, 148, and 150. Accordingly, the inlet and outletduct sections 124 and 126 may be tool-lessly coupled to form a closedchannel about the fan receptacles 128 and 130.

[0026] In assembly, the inlet duct section 124 may operate as a barrierto reduce the likelihood of physical damage to the fan-cooled componentsor fan units 132 and 134. Additionally, the inlet duct section 124 mayoperate to scoop or capture a greater portion of the inlet airflow 110into the multi-component-focused-cooling duct 100.

What is claimed is:
 1. A duct for cooling multiple components in aprocessor-based device, comprising: an inlet cooling duct section for acooling airflow focused toward a processor region; and at least one exitcooling duct section for the cooling airflow extending from the inletcooling duct section and focused toward a component region, wherein thecooling airflow is successively transportable through the processorregion followed by the component region.
 2. The duct of claim 1, whereinthe air inlet duct is adapted to direct and accelerate a forced airflowtoward the processor region.
 3. The duct of claim 1, wherein the inletcooling duct section comprises at least one fan receptacle.
 4. The ductof claim 3, wherein the inlet cooling duct section comprises a processorfan disposed in the fan receptacle.
 5. The duct of claim 3, wherein theinlet cooling duct section comprises an inlet duct section forming apassageway having a wall extending over the fan receptacle.
 6. The ductof claim 1, wherein the at least one exit cooling duct section isadapted to direct and accelerate the cooling airflow toward thecomponent region.
 7. The duct of claim 1, wherein the at least one exitcooling duct section comprises a converging passageway directed towardthe component region.
 8. The duct of claim 1, comprising a plurality ofcable hooks.
 9. The duct of claim 1, comprising at least one verticalretention member compressibly positionable between the duct and anadjacent component.
 10. A processor-based system, comprising: a focusedcooling duct, comprising: an inlet cooling duct section for a coolingairflow having a fan receptacle; and at least one exit cooling ductsection for the cooling airflow extending from the inlet cooling ductsection and focused toward a component region, wherein the coolingairflow is successively transportable through the inlet cooling ductsection followed by the plurality of exit cooling duct sections.
 11. Theprocessor-based system of claim 10, wherein the inlet cooling ductsection comprises another fan receptacle.
 12. The processor-based systemof claim 11, comprising a fan disposed in each of the fan receptacles.13. The processor-based system of claim 12, comprising at least oneprocessor disposed within the focused cooling duct.
 14. Theprocessor-based system of claim 12, wherein each one of the fans isadapted to transport the cooling airflow independently from each otherone of the fans.
 15. The processor-based system of claim 10, wherein theinlet cooling duct section comprises a passageway having a wallextending over the fan receptacle.
 16. The processor-based system ofclaim 10, wherein at least one of the plurality of exit cooling ductsections is adapted to direct and accelerate the cooling airflow towardat least one of the component regions.
 17. The processor-based system ofclaim 10, wherein at least one of the plurality of exit cooling ductsections comprises a converging passageway directed toward at least oneof the component regions.
 18. The processor-based system of claim 10,wherein the plurality of components comprise higher operatingtemperature tolerances than a component disposed in the focused coolingduct upstream from the plurality of components.
 19. The processor-basedsystem of claim 10, comprising a fan disposed upstream of the focusedcooling duct.
 20. A cooling system, comprising: means for channeling acooling airflow across at least one processor; and means forsubsequently refocusing via a duct the cooling airflow across at leastone electronic component downstream from the at least one processor. 21.The cooling system of claim 20, wherein the means for channelingcomprise an inlet cooling duct section.
 22. The cooling system of claim20, wherein the means for channeling comprise a duct mounted fan. 23.The cooling system of claim 20, wherein the means for channelingcomprise means for redundantly forcing the cooling airflow across the atleast one processor.
 24. The cooling system of claim 20, wherein themeans for subsequently refocusing comprise an exit cooling duct sectionconverging toward the at least one electronic component.
 25. The coolingsystem of claim 20, further comprising means for forcing air into themeans for channeling air.
 26. A method for cooling multiple componentsin a processor-based device, comprising: channeling a forced coolingairflow across a processor to transfer heat away from the processor; andrefocusing via a duct the forced cooling airflow heated by the processortoward at least one other electronic component downstream from theprocessor to transfer heat away from the at least one other electroniccomponent.
 27. The method of claim 26, wherein channeling comprisesfocusing the forced cooling airflow onto the processor in a componentregion.
 28. The method of claim 26, wherein channeling comprisestransporting the forced cooling airflow via an inlet cooling ductsection.
 29. The method of claim 26, wherein channeling comprisesflowing the forced cooling airflow via a fan.
 30. The method of claim26, wherein refocusing comprises directing and accelerating the forcedcooling airflow across the at least one other electronic component. 31.The method of claim 26, wherein channeling and refocusing comprisecooling components having higher operating temperatures tolerances oneafter the other.